| PCB 제조에 있어서의 품질개선 사례 연구 |
| 진홍기1, 백인권1, 손기목1, 서정원2 |
1LG생산기술원 시스템지원 Gr.
2LG전자 PCB OBU품질보증팀 |
| A Case Study for Quality Improvement Process for the PCB Manufacturing |
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| ABSTRACT |
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The following study has been undertaken to build QIP (Quality Improvement Process) of an inner-layer process in a PCB (Printed Circuit Board) manufacturing plant. The objective of the study is stabilization and optimization of the process through quality improvement. To do that, defective factors in process are gathered by the cause and effect analysis and classified by PFD (Process Flow Diagram), key factors are found out by PFMECA (Process Failure Mode and Effect Criticalty Analisis), DOE(Design of Experiments) is a, pp.ied to those key factors to optimize the process, SPC (Statistical Process Control) chart is used to maintain the optimal conditions of the process and to improve quality continuously, and a quality management system is developed to improve quality mind and quality system for the PCB jmanufacturing plant. Overall, QIP is established to improve quality for the PCB manufacturing plant in the study. |
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